Performing Thermal Analysis in System
May 1, 2006
Integrated circuit (IC) manufacturers normally publish a thermal resistance rating ( thermal resistance from die junction-to-ambient air) on their data...
Enhance MOSFET Cooling with Thermal Vias
Feb 1, 2006
Bottom-side cooling enables MOSFET heat transfer through the pc board to a heatsink. This decreases MOSFET junction temperatures while reducing the required area and thermal stress on the board....
Innovative Heatsink Enables Hot Uplinks
Nov 1, 2004
New consumer technologies such as 3G, WIFI, HDTV and their associated networks are driven by a consumer expectation that their always on device must be...
Package Development Goes with the (Air) Flow
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...
Online Thermal Model Delivers Heat Sink Solutions
Aug 1, 2001
Today's power electronic system designers need quick and accurate heat sink solutions to ensure high reliability. The advent of the Internet and its potential for providing interactive design capability met this need. ...
Ensure AC Film Capacitor Reliability with Thermal Analysis
Mar 1, 2001
When employing electrolytic, ceramic, and film capacitors in various configurations for high ripple current applications, you run the risk of stressing the capacitor, which leads to premature failure....
