Tackle Thermal Design At the System Level
Jun 1, 2008
Designing a cost-competitive electronic system requires careful consideration of the thermal domain as well as the electrical domain, especially where...
Don't Be Misled by Power Device Specs
May 1, 2008
Understanding that maximum device power is situation dependent can go a long way in explaining why semiconductor data-sheet specifications for power can be misleading...
Psi or Theta: Which One Should You Choose?
Mar 1, 2008
Over the years, standards organizations have undertaken numerous efforts to standardize the test methods that are used to characterize the thermal performance...
Model PCB Thermals with Greater Accuracy
Feb 1, 2008
Electronics companies at the leading edge of performance are being forced to address board-level thermal requirements at the earliest stages of design....
Beyond the Data Sheet: Demystifying Thermal Runaway
Nov 1, 2007
Mathematical modeling of thermal runaway and a proper thermal analysis of all interacting heat sources can clarify how a device can be designed within the specified operating margins outlined on the manufacturer's data sheet....
Part Two: Linear Superposition Speeds Thermal Modeling
Feb 1, 2007
In a thermally linear system, superposition may be
applied to predict the transient response of the system to step changes in input power. This article is the second in a two-part series....
Part One: Linear Superposition Speeds Thermal Modeling
Jan 1, 2007
When thermal simulation software isn't available, or for quicker results, designers can apply linear superposition to model the thermal performance of their power systems. This article is the first in a two-part series....
Microchannels Take Heatsinks to the Next Level
Nov 1, 2006
The convective performance of microchannel cooling
systems for high-power electronics can be improved to
the point where the total thermal resistivity is no longer dominated by the heatsink....
A Systematic Approach Optimizes Magnetics
Jul 1, 2006
A two-stage approach to inductor and transformer design ensures the design meets market and system requirements at the lowest possible cost and with few design iterations....
Designing Battery Packs for Thermal Extremes
Jul 1, 2006
While battery packs enable individual cell capacities to be scaled in series/parallel configurations to suit portable applications, they must also provide thermal management in extreme environments....
Novel SiC Diode Solves PFC Challenges
Jun 1, 2006
Wide-input-range power factor correction (PFC) converters present some of the most difficult component challenges in ac-dc power electronics. With an...
Why Is My DC-DC Converter Too Hot?
Jun 1, 2006
The bulleted items on the front page of a dc-dc power module's data sheet often highlight electrical performance that the product cannot actually deliver...
Performing Thermal Analysis in System
May 1, 2006
Integrated circuit (IC) manufacturers normally publish a thermal resistance rating ( thermal resistance from die junction-to-ambient air) on their data...
Enhance MOSFET Cooling with Thermal Vias
Feb 1, 2006
Bottom-side cooling enables MOSFET heat transfer through the pc board to a heatsink. This decreases MOSFET junction temperatures while reducing the required area and thermal stress on the board....
