Power Electronics

Thermal Interface Materials

Designing Battery Packs for Thermal Extremes 
Jul 1, 2006
While battery packs enable individual cell capacities to be scaled in series/parallel configurations to suit portable applications, they must also provide thermal management in extreme environments....

Why Is My DC-DC Converter Too Hot? 
Jun 1, 2006
The bulleted items on the front page of a dc-dc power module's data sheet often highlight electrical performance that the product cannot actually deliver...

Performing Thermal Analysis in System 
May 1, 2006
Integrated circuit (IC) manufacturers normally publish a thermal resistance rating ( thermal resistance from die junction-to-ambient air) on their data...

Injection Molding Reshapes Cooling Components 
Apr 1, 2006
An advanced metal injection-molding technology makes it possible to build heatsinks and liquid-cooled cold plates in any shape....

New Products: March 2006 
Mar 23, 2006
This issue of Power Electronics Technology features analog switches, buck regulator for GPUs, LED driver, SMT inductor/transformer......

Thermal Materials Solve Power Electronics Challenges 
Feb 1, 2006
Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors...

Enhance MOSFET Cooling with Thermal Vias 
Feb 1, 2006
Bottom-side cooling enables MOSFET heat transfer through the pc board to a heatsink. This decreases MOSFET junction temperatures while reducing the required area and thermal stress on the board....

Package Development Goes with the (Air) Flow 
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...

Dry-to-the-Touch Thermal Grease Cuts Installation Mess 
Aug 1, 2002
A dry-to-the-touch thermal grease product offers the lowest thermal resistance at low closure force - with handling ease....

CHILLIN' OUT With New Pre-preg Materials 
Nov 1, 2001
To accommodate ever-increasing power density, power products and power circuits require substrates and p. c. boards with lower thermal resistance....

Insulated Metal Substrates Reduce Thermal Impedance 
Sep 1, 2001
Today's higher reliability electronic systems mandate a need for optimal thermal management solutions. Watt-density goals have generated additional requirements...

Comparison of Semiconductor Mounting Techniques Reveals Thermal Differences 
May 1, 2001
Optimized heat sink, interface materials, and attachment method required for efficient cooling....

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Thermal Management News

EPRI To Evaluate Adding Solar Thermal Energy To Coal Plants

Silicone-Free Interface Material Provides High Thermal Conductivity

Cooling Specialist Acquires Components Provider

Liquid Cooling Is Coming To Chips and Boards

IGBT Baseplates Feature Low CTEs

 
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Topic Index

Discrete Semis
Bipolar Transistors
IGBTs
Power Modules
Power MOSFETs
Rectifiers/Diodes
Thyristors

Power Management
Digital Power Control
High-Voltage Devices
LED Drivers
Lighting Power Management
Motor Power Management
Power ICs
PWM Controllers
Regulator ICs

Portable Power Management
Batteries
Battery Charger ICs
Fuel Gauges Controllers and Regulators
Micro Fuel Cells

Passives/Packaging
Capacitors
Circuit Protection Devices
Connectors
Magnetics
Packaging
Printed Circuit Boards
Resistors
Sensors & Transducers
Switches & Electromagnetic Relays

Topic Pages
Wind Power
Flyback Transformers

Thermal Management
Fans
Heatpipes & Spreaders
Heatsinks
Liquid Cooling
Thermal Interface Materials
Thermal Management Simulation

Power Systems
DC-DC Converters
Distributed Power Architectures
EMI & EMC
Linear Power Supplies
Safety/Environmental Approvals
Simulation/Modeling
Switch-Mode Power Supplies
Test & Measurement Uninterruptible Power Supplies

Digital Power
Commentaries
Digital Power News
Digital Power Products
Design Features


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