Designing Battery Packs for Thermal Extremes
Jul 1, 2006
While battery packs enable individual cell capacities to be scaled in series/parallel configurations to suit portable applications, they must also provide thermal management in extreme environments....
Why Is My DC-DC Converter Too Hot?
Jun 1, 2006
The bulleted items on the front page of a dc-dc power module's data sheet often highlight electrical performance that the product cannot actually deliver...
Performing Thermal Analysis in System
May 1, 2006
Integrated circuit (IC) manufacturers normally publish a thermal resistance rating ( thermal resistance from die junction-to-ambient air) on their data...
Injection Molding Reshapes Cooling Components
Apr 1, 2006
An advanced metal injection-molding technology makes it possible to build heatsinks and liquid-cooled cold plates in any shape....
New Products: March 2006
Mar 23, 2006
This issue of Power Electronics Technology features analog switches, buck regulator for GPUs, LED driver, SMT inductor/transformer......
Thermal Materials Solve Power Electronics Challenges
Feb 1, 2006
Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors...
Enhance MOSFET Cooling with Thermal Vias
Feb 1, 2006
Bottom-side cooling enables MOSFET heat transfer through the pc board to a heatsink. This decreases MOSFET junction temperatures while reducing the required area and thermal stress on the board....
Package Development Goes with the (Air) Flow
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...
CHILLIN' OUT With New Pre-preg Materials
Nov 1, 2001
To accommodate ever-increasing power density, power products and power circuits require substrates and p. c. boards with lower thermal resistance....
Insulated Metal Substrates Reduce Thermal Impedance
Sep 1, 2001
Today's higher reliability electronic systems mandate a need for optimal thermal management solutions. Watt-density goals have generated additional requirements...
