Liquid Flow-Through Chassis Scales for Applications

Jul 5, 2006 11:17 AM

An advanced standards-based technology liquid cooling demonstrator from Parker Hannifin for high-power embedded electronics applications supports manufacturers and users of open-system architectures. The product can be scaled to accommodate the required amount of technology integration for individual applications, and is hybrid-backplane capable to accommodate any board technology, including VME, VITA 41/VXS, and VITA 46-48/VPX (REDI). A modular design approach allows this advanced development chassis to be used through several tech-refresh cycles, thus considerably lowering the system’s total cost of ownership.

The packaging for the LFT demonstrator chassis is an air transport rack (1-ATR long) standard-sized enclosure of approximately 8 in. x 10 in. x 20 in. The system is entirely self-contained, with its own closed-loop liquid cooling system. The system contains coolant, a control system, smart pump, filter, accumulator, heaters (for cold-system startup), and three different board-level heat-absorbing technologies to demonstrate the variety of options available to the electronics designer.

Parker’s LFT chassis is capable of cooling up to a maximum of 850 W per slot, a total of 2000 W with dielectric fluids such as hydrofluoroethers (HFE) and synthetic oil (PAO), or 4000 W with non-dielectric fluids such as water or water/glycol mixtures.

The product is designed for military implementation with shock, vibration, and acceleration to MIL-STD-810F. It has EMI/EMC to MIL-STD-461E and operation from -40°C to 85°C. For pricing, contact Parker.