Power Electronics
  

Liquid Cooling

Nonlinear Fin Patterns Keep Cold Plates Cooler 
Feb 1, 2007
Altering the fin geometry of liquid-cooled cold plates improves their thermal efficiency....

Microchannels Take Heatsinks to the Next Level 
Nov 1, 2006
The convective performance of microchannel cooling systems for high-power electronics can be improved to the point where the total thermal resistivity is no longer dominated by the heatsink....

Modular Approach Simplifies Power-System Design 
May 1, 2006
The introduction of the first ICs in the early 1960s greatly simplified the design and manufacturability of complex electronic circuits by combining many...

Liquid Cooling for High-Power Electronics 
Feb 1, 2005
To remove heat generated in power semiconductor modules, a liquid-cooled cold plate offers a solution that reduces the barriers to heat flow while maintaining the mechanical integrity of the package....

Package Development Goes with the (Air) Flow 
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...

Liquid-Cooled Heatsinks Enable Smaller, Cooler Devices 
Jun 1, 2003
Careful consideration of mechanical, hydraulic, power, and cost requirements helps determine the best thermal management solution for high-power applications....

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Thermal Management News

EPRI To Evaluate Adding Solar Thermal Energy To Coal Plants

Silicone-Free Interface Material Provides High Thermal Conductivity

Cooling Specialist Acquires Components Provider

Liquid Cooling Is Coming To Chips and Boards

IGBT Baseplates Feature Low CTEs
 
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