Microchannels Take Heatsinks to the Next Level
Nov 1, 2006
The convective performance of microchannel cooling
systems for high-power electronics can be improved to
the point where the total thermal resistivity is no longer dominated by the heatsink....
Modular Approach Simplifies Power-System Design
May 1, 2006
The introduction of the first ICs in the early 1960s greatly simplified the design and manufacturability of complex electronic circuits by combining many...
Liquid Cooling for High-Power Electronics
Feb 1, 2005
To remove heat generated in power semiconductor
modules, a liquid-cooled cold plate offers a
solution that reduces the barriers to heat flow
while maintaining the mechanical integrity of the
package....
Package Development Goes with the (Air) Flow
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...
Liquid-Cooled Heatsinks Enable Smaller, Cooler Devices
Jun 1, 2003
Careful consideration of mechanical, hydraulic, power, and cost requirements helps determine the best thermal management solution for high-power applications....
