MOSFET Packaging Boosts Current Density
May 1, 2004
The newest silicon technology has made packaging the limiting factor for higher performance MOSFETs. In some of the latest products, as much as 50% of...
Thermal Management of Planar Magnetics
Feb 1, 2004
Planar transformers and inductors for high-frequency converters differ radically from conventional magnetics in that they do not use magnet wire. Instead,...
Liquid-Cooled Heatsinks Enable Smaller, Cooler Devices
Jun 1, 2003
Careful consideration of mechanical, hydraulic, power, and cost requirements helps determine the best thermal management solution for high-power applications....
Tests Compare Forced Convection Heat Transfer
Mar 1, 2003
Maintaining junction temperatures is essential for power and microprocessors at the p.c. board level. Tests now can compare forced convection heat transfer for swaged, mixed-metal heatsinks to help maintain these temperatures....
Optimize Fin Spacing: How Close Is Too Close?
Aug 1, 2002
Even with all the hype about forced convection cooling, many applications in the electronics cooling industry still depend on natural convection cooling....
Cooling Trends Direct Efficient Thermal Design
Jun 1, 2002
Cooling solutions such as heatsinks, fans, heat spreaders, and thermal gap fillers help keep temperatures within the specified limits, ensuring efficient operation of power electronics systems....
Online Thermal Model Delivers Heat Sink Solutions
Aug 1, 2001
Today's power electronic system designers need quick and accurate heat sink solutions to ensure high reliability. The advent of the Internet and its potential for providing interactive design capability met this need. ...
