Data Points
May 1, 2006
Microsite Turns Spotlight on Digital Power For engineers interested in the emerging area of digital power-supply design, a new microsite offers a unique...
Rectifier ICs and Thermal Packaging Enhance SMPS
May 1, 2006
The personal computer has significantly evolved over the last 30 years, with performance driven by Moore's Law and cost pushing downward due to component...
Modular Approach Simplifies Power-System Design
May 1, 2006
The introduction of the first ICs in the early 1960s greatly simplified the design and manufacturability of complex electronic circuits by combining many...
Injection Molding Reshapes Cooling Components
Apr 1, 2006
An advanced metal injection-molding technology makes it possible to build heatsinks and liquid-cooled cold plates in any shape....
New Products: March 2006
Mar 23, 2006
This issue of Power Electronics Technology features analog switches, buck regulator for GPUs, LED driver, SMT inductor/transformer......
Enhance MOSFET Cooling with Thermal Vias
Feb 1, 2006
Bottom-side cooling enables MOSFET heat transfer through the pc board to a heatsink. This decreases MOSFET junction temperatures while reducing the required area and thermal stress on the board....
Thermal Issues Count in High-Power Amp Design
Jun 1, 2005
Designers can make sound decisions for
dissipating the heat by choosing devices,
heatsinks and circuits that will realize the
smallest, best-performing design....
Liquid Cooling for High-Power Electronics
Feb 1, 2005
To remove heat generated in power semiconductor
modules, a liquid-cooled cold plate offers a
solution that reduces the barriers to heat flow
while maintaining the mechanical integrity of the
package....
Package Development Goes with the (Air) Flow
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...
Power Packaging Spins New Automotive Capabilities
Nov 1, 2004
A power packaging technology from International Rectifier (IR) improves current handling capabilities and lowers cost versus existing packaging techniques....
Innovative Heatsink Enables Hot Uplinks
Nov 1, 2004
New consumer technologies such as 3G, WIFI, HDTV and their associated networks are driven by a consumer expectation that their always on device must be...
High-Density Power Package for the PC Market
Nov 1, 2004
The very high current demands of modern PCs have placed pressures on dc-dc converter design engineers to come up with solutions that meet ever-increasing...
MOSFET is Thermally Enhanced for DC-DC
Nov 1, 2004
The SO-8 has been the most popular package type used for power MOSFETs in dc-dc converters for more than a decade. The package is well understood and...
Characterizing Mixed-Metal Heatsinks
Jun 1, 2004
High temperature and heat dissipation are the factors currently limiting electronic system capabilities. Two primary applications require heatsinks: the...
MOSFET Packaging Boosts Current Density
May 1, 2004
The newest silicon technology has made packaging the limiting factor for higher performance MOSFETs. In some of the latest products, as much as 50% of...
