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MOSFET is Thermally Enhanced for DC-DC 
Nov 1, 2004
The SO-8 has been the most popular package type used for power MOSFETs in dc-dc converters for more than a decade. The package is well understood and...

Package Development Goes with the (Air) Flow 
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...

Power Packaging Spins New Automotive Capabilities 
Nov 1, 2004
A power packaging technology from International Rectifier (IR) improves current handling capabilities and lowers cost versus existing packaging techniques....

Characterizing Mixed-Metal Heatsinks 
Jun 1, 2004
High temperature and heat dissipation are the factors currently limiting electronic system capabilities. Two primary applications require heatsinks: the...

MOSFET Packaging Boosts Current Density 
May 1, 2004
The newest silicon technology has made packaging the limiting factor for higher performance MOSFETs. In some of the latest products, as much as 50% of...

Tackling the Challenges of Power Dissipation 
Apr 1, 2004
Simple thermal calculations and bench tests enable small outline devices such as the DFN to deliver high currents....

Thermal Management of Planar Magnetics 
Feb 1, 2004
Planar transformers and inductors for high-frequency converters differ radically from conventional magnetics in that they do not use magnet wire. Instead,...

Liquid-Cooled Heatsinks Enable Smaller, Cooler Devices 
Jun 1, 2003
Careful consideration of mechanical, hydraulic, power, and cost requirements helps determine the best thermal management solution for high-power applications....

Tests Compare Forced Convection Heat Transfer 
Mar 1, 2003
Maintaining junction temperatures is essential for power and microprocessors at the p.c. board level. Tests now can compare forced convection heat transfer for swaged, mixed-metal heatsinks to help maintain these temperatures....

Optimize Fin Spacing: How Close Is Too Close? 
Aug 1, 2002
Even with all the hype about forced convection cooling, many applications in the electronics cooling industry still depend on natural convection cooling....

Cooling Trends Direct Efficient Thermal Design 
Jun 1, 2002
Cooling solutions such as heatsinks, fans, heat spreaders, and thermal gap fillers help keep temperatures within the specified limits, ensuring efficient operation of power electronics systems....

Online Thermal Model Delivers Heat Sink Solutions 
Aug 1, 2001
Today's power electronic system designers need quick and accurate heat sink solutions to ensure high reliability. The advent of the Internet and its potential for providing interactive design capability met this need. ...

Comparison of Semiconductor Mounting Techniques Reveals Thermal Differences 
May 1, 2001
Optimized heat sink, interface materials, and attachment method required for efficient cooling....

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