One Powerful Decade Update: Vapor Chamber Heat Sinks
Aug 1, 2010
Using vapor chambers can be an efficient way to manage heat in today’s small die, high-power semiconductor devices where effective cooling helps ensure long component life and reliability...
Ultra High Ratio Extrusion Heat Sinks Improve Cooling
May 1, 2010
Minimizing cost and maximizing thermal performance are the obvious goals of cooling a power semiconductor. Thermal performance is related to the power...
Flared-Pin Heat Sinks Provide an Alternative for Natural Convection
May 26, 2009
Cool Innovations Inc. introduced a line of flared pin fin heat sinks that provide cooling power specifically optimized for natural convection environments. They feature a rugged array of round pins and are suitable for harsh industrial environments....
Reticulated Metal Foams Build Better Heatsinks
Nov 1, 2007
An alternative to conventional finned heatsinks and coldplates, blocks of RMF material can provide greater cooling for power modules with high levels of power dissipation....
Microchannels Take Heatsinks to the Next Level
Nov 1, 2006
The convective performance of microchannel cooling
systems for high-power electronics can be improved to
the point where the total thermal resistivity is no longer dominated by the heatsink....
Enhance Triac Reliability Through Thermal Design
Sep 1, 2006
Appliance applications illustrate how to perform the necessary thermal calculations using datasheet information supplied by the semiconductor vendor....
Why Is My DC-DC Converter Too Hot?
Jun 1, 2006
The bulleted items on the front page of a dc-dc power module's data sheet often highlight electrical performance that the product cannot actually deliver...
Data Points
May 1, 2006
Microsite Turns Spotlight on Digital Power For engineers interested in the emerging area of digital power-supply design, a new microsite offers a unique...
Rectifier ICs and Thermal Packaging Enhance SMPS
May 1, 2006
The personal computer has significantly evolved over the last 30 years, with performance driven by Moore's Law and cost pushing downward due to component...
Modular Approach Simplifies Power-System Design
May 1, 2006
The introduction of the first ICs in the early 1960s greatly simplified the design and manufacturability of complex electronic circuits by combining many...
Injection Molding Reshapes Cooling Components
Apr 1, 2006
An advanced metal injection-molding technology makes it possible to build heatsinks and liquid-cooled cold plates in any shape....
New Products: March 2006
Mar 23, 2006
This issue of Power Electronics Technology features analog switches, buck regulator for GPUs, LED driver, SMT inductor/transformer......
Enhance MOSFET Cooling with Thermal Vias
Feb 1, 2006
Bottom-side cooling enables MOSFET heat transfer through the pc board to a heatsink. This decreases MOSFET junction temperatures while reducing the required area and thermal stress on the board....
