Injection Molding Reshapes Cooling Components
Apr 1, 2006
An advanced metal injection-molding technology makes it possible to build heatsinks and liquid-cooled cold plates in any shape....
Thermal Materials Solve Power Electronics Challenges
Feb 1, 2006
Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors...
Liquid Cooling for High-Power Electronics
Feb 1, 2005
To remove heat generated in power semiconductor
modules, a liquid-cooled cold plate offers a
solution that reduces the barriers to heat flow
while maintaining the mechanical integrity of the
package....
Package Development Goes with the (Air) Flow
Nov 1, 2004
With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending...
Heat Pipe Reliability in High-Power Applications
Aug 1, 2004
Over the past decade, the use of heat pipes in electronic cooling applications has increased dramatically, primarily in notebook computers. In fact, virtually...
Facing Thermal Solutions with Heat Pipe Technology
Aug 1, 2002
Heat pipes reduce the space required to ensure remote heat transfer, improve thermal efficiency, and add little weight to the solution....
Cooling Trends Direct Efficient Thermal Design
Jun 1, 2002
Cooling solutions such as heatsinks, fans, heat spreaders, and thermal gap fillers help keep temperatures within the specified limits, ensuring efficient operation of power electronics systems....
