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Thermal Management
Diverse Cooling Devices Pace Race To Get The Heat Out Of ICsOct 26, 2011 3:53 PM Allan, Roger The need for heat sinks, heat pipes, temperature sensors, switches, and improved materials continues unabated as ICs shrink in size while providing higher performance, putting even more strain on cooling requirements. ... LED Coolers Utilize Aerospace Fluid-Bearing TechnologyInspired by expertise from the Aerospace Industry, Jaro's new tightly-designed MR-16 LED coolers optimize longevity and temperature with a highly-efficient fluid-bearing structure.... advertisement HeatsinksHigh Power Density Heat SinksDesigned for applications requiring high power densities and where forced air cooling is present, Ohmite has released a larger version of their MV/MA 102 heat sink which, due to longer and more efficient fin extrusions, give nearly twice the thermal performance. ... Power Resistor Heat SinksDesigned for applications requiring high power densities and where forced air cooling is present, Ohmite has released a larger version of their MV/MA heatsink which provides even more heat dissipation. ...
Thermal Management SimulationHow Hot is Too Hot? Ask SherlockPower supply engineers have access to more powerful thermal simulation tools than ever before. Finite element analysis and computational fluid dynamics can provide highly accurate predictions for even very complex thermal management solutions. However, these new capabilities fail to answer the most critical question: How hot is too hot? ... Military’s Demands Drive Innovative Thermal Management SolutionsExisting thermal management techniques are helping military electronics survive in severe environments. To ensure system robustness, thermal management technologies must keep pace with newer heat-producing systems. ...
Thermal Management NewsEPRI To Evaluate Adding Solar Thermal Energy To Coal PlantsThe Electric Power Research Institute (EPRI) announced that it has launched the second of two projects to help electric power companies add solar energy to fossil-fueled electric power plants, reducing fuel costs and plant emissions... Silicone-Free Interface Material Provides High Thermal ConductivityMH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices... Cooling Specialist Acquires Components ProviderWaytronx, the provider of openly licensable advanced systems cooling solutions, has acquired CUI, provider of electronic components... Liquid Cooling Is Coming To Chips and BoardsOnline columnist Lou Pechi argues that the now-popular techniques for cooling chips and pc boards are becoming inadequate as levels of power dissipation continue to rise...
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January 1, 2012
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advertisement advertisement Thermal Management NewsEPRI To Evaluate Adding Solar Thermal Energy To Coal PlantsSilicone-Free Interface Material Provides High Thermal ConductivityCooling Specialist Acquires Components ProviderLiquid Cooling Is Coming To Chips and BoardsIGBT Baseplates Feature Low CTEs |
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