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Thermal Management

Beyond the Data Sheet: Demystifying Thermal Runaway

Mathematical modeling of thermal runaway and a proper thermal analysis of all interacting heat sources can clarify how a device can be designed within the specified operating margins outlined on the manufacturer's data sheet....

Heatsinks

Reticulated Metal Foams Build Better Heatsinks

An alternative to conventional finned heatsinks and coldplates, blocks of RMF material can provide greater cooling for power modules with high levels of power dissipation....

Nonlinear Fin Patterns Keep Cold Plates Cooler

Altering the fin geometry of liquid-cooled cold plates improves their thermal efficiency....


Fans

A Simple Latching Watchdog Timer

Most watchdog-timer ICs produce a single limited-duration output pulse when the watchdog timeout expires. Some applications, however, require the output to latch. This simple circuit provides a latched failure indication in response to a loss of the input pulse stream....

Heatpipes & Spreaders

Injection Molding Reshapes Cooling Components

An advanced metal injection-molding technology makes it possible to build heatsinks and liquid-cooled cold plates in any shape....

Thermal Management Simulation

Psi or Theta: Which One Should You Choose?

Over the years, standards organizations have undertaken numerous efforts to standardize the test methods that are used to characterize the thermal performance...

Model PCB Thermals with Greater Accuracy

Electronics companies at the leading edge of performance are being forced to address board-level thermal requirements at the earliest stages of design....


Liquid Cooling

Nonlinear Fin Patterns Keep Cold Plates Cooler

Altering the fin geometry of liquid-cooled cold plates improves their thermal efficiency....

Interface Materials

Designing Battery Packs for Thermal Extremes

While battery packs enable individual cell capacities to be scaled in series/parallel configurations to suit portable applications, they must also provide thermal management in extreme environments....

Thermal Management News

Liquid Cooling Is Coming To Chips and Boards

Online columnist Lou Pechi argues that the now-popular techniques for cooling chips and pc boards are becoming inadequate as levels of power dissipation continue to rise...

IGBT Baseplates Feature Low CTEs

CPS’s aluminum silicon carbide (AlSiC) is a metal-matrix composite ideally suited for base-plate material for IGBTs used in high-power applications...

Firm Opens Thermal Design-and-Test Facility

Degree Controls has opened its center for airflow and thermal technologies (CATT) facility in Santa Clara, Calif. ...

Partnership Targets Data-Center Cooling

Through an agreement, APC-MGE and STULZ will deliver customers comprehensive, integrated data center cooling solutions and services. ...


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Thermal Management News

Liquid Cooling Is Coming To Chips and Boards

IGBT Baseplates Feature Low CTEs

Firm Opens Thermal Design-and-Test Facility

Partnership Targets Data-Center Cooling

Cooling Fan Maker Expands Regional Presence

 
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Topic Index

Discrete Semis
Bipolar Transistors
IGBTs
Power Modules
Power MOSFETs
Rectifiers/Diodes
Thyristors

Power Management
Digital Power Control
High-Voltage Devices
LED Drivers
Lighting Power Management
Motor Power Management
Power ICs
PWM Controllers
Regulator ICs

Portable Power Management
Batteries
Battery Charger ICs
Fuel Gauges Controllers and Regulators
Micro Fuel Cells

Passives/Packaging
Capacitors
Circuit Protection Devices
Connectors
Magnetics
Packaging
Printed Circuit Boards
Resistors
Sensors & Transducers
Switches & Electromagnetic Relays

Topic Pages
Wind Power
Flyback Transformers

Thermal Management
Fans
Heatpipes & Spreaders
Heatsinks
Liquid Cooling
Thermal Interface Materials
Thermal Management Simulation

Power Systems
DC-DC Converters
Distributed Power Architectures
EMI & EMC
Linear Power Supplies
Safety/Environmental Approvals
Simulation/Modeling
Switch-Mode Power Supplies
Test & Measurement Uninterruptible Power Supplies

Digital Power
Commentaries
Digital Power News
Digital Power Products
Design Features


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