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Thermal Management
Direct Cooling of Power Modules Using Microchannel StructuresMar 1, 2010 12:00 PM As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily... advertisement HeatsinksAll-Metal Bonded-Fin Heat Sinks Shrink Size, Improve Thermal CharacteristicsEver-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended... Ultra High Ratio Extrusion Heat Sinks Improve CoolingMinimizing cost and maximizing thermal performance are the obvious goals of cooling a power semiconductor. Thermal performance is related to the power...
Thermal Management SimulationTackle Thermal Design At the System LevelDesigning a cost-competitive electronic system requires careful consideration of the thermal domain as well as the electrical domain, especially where... Don't Be Misled by Power Device SpecsUnderstanding that maximum device power is situation dependent can go a long way in explaining why semiconductor data-sheet specifications for power can be misleading...
Thermal Management NewsEPRI To Evaluate Adding Solar Thermal Energy To Coal PlantsThe Electric Power Research Institute (EPRI) announced that it has launched the second of two projects to help electric power companies add solar energy to fossil-fueled electric power plants, reducing fuel costs and plant emissions... Silicone-Free Interface Material Provides High Thermal ConductivityMH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices... Cooling Specialist Acquires Components ProviderWaytronx, the provider of openly licensable advanced systems cooling solutions, has acquired CUI, provider of electronic components... Liquid Cooling Is Coming To Chips and BoardsOnline columnist Lou Pechi argues that the now-popular techniques for cooling chips and pc boards are becoming inadequate as levels of power dissipation continue to rise...
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advertisement Most Popular ArticlesNews From PETech TimesSIA Reports May 2010 Global Chip Sales Rose 4.5% Month-On-MonthUL Developing First-Edition Standard For Wireless Charging Devices For Use With Low-Energy ProductsThermacore Acquires PMT and Expands Thermal CapabilitiesGlobal Market For Thermal Management Technologies To Be Worth $10.2 Billion In 2015Large and Advanced Battery Technology Market to be Worth $11 Billion in 2014Add This RSS FeedResourcesAdvertisementadvertisement |
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July 1, 2010
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advertisement advertisement Thermal Management NewsEPRI To Evaluate Adding Solar Thermal Energy To Coal PlantsSilicone-Free Interface Material Provides High Thermal ConductivityCooling Specialist Acquires Components ProviderLiquid Cooling Is Coming To Chips and BoardsIGBT Baseplates Feature Low CTEs |
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