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Thermal ManagementThermal Management Tools Face Cooling IssuesICs and the Packages that house them continue to shrink. In the meantime, they are operating at higher frequencies and offering higher-performance levels... advertisement HeatsinksFlared-Pin Heat Sinks Provide an Alternative for Natural ConvectionCool Innovations Inc. introduced a line of flared pin fin heat sinks that provide cooling power specifically optimized for natural convection environments. They feature a rugged array of round pins and are suitable for harsh industrial environments.... Reticulated Metal Foams Build Better HeatsinksAn alternative to conventional finned heatsinks and coldplates, blocks of RMF material can provide greater cooling for power modules with high levels of power dissipation....
Thermal Management SimulationTackle Thermal Design At the System LevelDesigning a cost-competitive electronic system requires careful consideration of the thermal domain as well as the electrical domain, especially where... Don't Be Misled by Power Device SpecsUnderstanding that maximum device power is situation dependent can go a long way in explaining why semiconductor data-sheet specifications for power can be misleading...
Thermal Management NewsEPRI To Evaluate Adding Solar Thermal Energy To Coal PlantsThe Electric Power Research Institute (EPRI) announced that it has launched the second of two projects to help electric power companies add solar energy to fossil-fueled electric power plants, reducing fuel costs and plant emissions... Silicone-Free Interface Material Provides High Thermal ConductivityMH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices... Cooling Specialist Acquires Components ProviderWaytronx, the provider of openly licensable advanced systems cooling solutions, has acquired CUI, provider of electronic components... Liquid Cooling Is Coming To Chips and BoardsOnline columnist Lou Pechi argues that the now-popular techniques for cooling chips and pc boards are becoming inadequate as levels of power dissipation continue to rise... |
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advertisement Most Popular ArticlesNews From PETech Times2009 - A bigger Drain on the Power IC market than Expected!Wireless Power Supplies and Contactless Energy TransferGemini Solar Selected for 30MW PV ProjectMIT Uses Nano-Origami to Build Tiny Electronic DevicesAnalog Devices Acquires Technology for Smart-Grid EnergyAdd This RSS FeedResourcesAdvertisementadvertisement |
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advertisement advertisement Thermal Management NewsEPRI To Evaluate Adding Solar Thermal Energy To Coal PlantsSilicone-Free Interface Material Provides High Thermal ConductivityCooling Specialist Acquires Components ProviderLiquid Cooling Is Coming To Chips and BoardsIGBT Baseplates Feature Low CTEs |
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