Flared-Pin Heat Sinks Provide an Alternative for Natural Convection

Cool Innovations Inc. introduced a line of flared pin fin heat sinks that provide cooling power specifically optimized for natural convection environments. They feature a rugged array of round pins and are suitable for harsh industrial environments....

Reticulated Metal Foams Build Better Heatsinks

An alternative to conventional finned heatsinks and coldplates, blocks of RMF material can provide greater cooling for power modules with high levels of power dissipation....

Tackle Thermal Design At the System Level

Designing a cost-competitive electronic system requires careful consideration of the thermal domain as well as the electrical domain, especially where...

Don't Be Misled by Power Device Specs

Understanding that maximum device power is situation dependent can go a long way in explaining why semiconductor data-sheet specifications for power can be misleading...

EPRI To Evaluate Adding Solar Thermal Energy To Coal Plants

The Electric Power Research Institute (EPRI) announced that it has launched the second of two projects to help electric power companies add solar energy to fossil-fueled electric power plants, reducing fuel costs and plant emissions...

Silicone-Free Interface Material Provides High Thermal Conductivity

MH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices...

Cooling Specialist Acquires Components Provider

Waytronx, the provider of openly licensable advanced systems cooling solutions, has acquired CUI, provider of electronic components...

Liquid Cooling Is Coming To Chips and Boards

Online columnist Lou Pechi argues that the now-popular techniques for cooling chips and pc boards are becoming inadequate as levels of power dissipation continue to rise...