Overcoming PCMCIA Power Limits in Modem Designs
May 1, 2006
Demand for wireless network access to support mobile computing requirements is growing at a rapid pace. As a result, the Global System for Mobile Communication...
Topology Selection by the Numbers Part Three
May 1, 2006
In parts one and two of this article series, the component stress factor (CSF) method was defined and some examples of how to use it were given, concentrating...
Data Points
May 1, 2006
Microsite Turns Spotlight on Digital Power For engineers interested in the emerging area of digital power-supply design, a new microsite offers a unique...
Performing Thermal Analysis in System
May 1, 2006
Integrated circuit (IC) manufacturers normally publish a thermal resistance rating ( thermal resistance from die junction-to-ambient air) on their data...
Topology Selection By the Numbers Part Two
Apr 1, 2006
In this second part of a three-part series, we consider some of the alternatives to the bucks and boosts discussed in part one for nonisolated stepup and stepdown conversion for situations in which there may be better choices....
Topology Selection by the Numbers Part One
Mar 1, 2006
Is the topology you selected for your current power supply design the best topology available? Often, there are several different approaches we can take...
Evaluating TVS Protection Circuits with SPICE
Jan 1, 2006
SPICE circuit simulations are a powerful design tool to analyze a system's immunity against conducted EMI surge voltages. SPICE can serve as a valuable...
A Graphical Approach To MOSFET Evaluation
Oct 1, 2005
Using a new version of power MOSFET figure of
merit and constant-power dissipation curves,
designers can calculate the optimum combination
of factors to select a device for a power supply
application and minimize its dissipation....
Impact of Burn-In on Power Supply Reliability
Sep 1, 2005
Through proper testing and analysis of the accumulated data, power supply manufacturers can select the appropriate level of burn-in to drive high field reliability while achieving cost goals....
Environmental Testing Benefits Power Electronics
Jul 28, 2005
Integrating test and measurement with environmental testing can improve product robustness, product reliability and production processes, increasing yields and reducing warranty expenses and exposure....
SPICE Analog Behavioral Modeling of Variable Passives
May 1, 2005
In this third and final installment, the technique for modeling variable passives in SPICE is applied to inductors. When an inductor is energized, it...
Modeling Integrated Magnetic Components
Mar 1, 2005
Using finite element analysis (FEA) techniques, a
simulation tool generates frequency-dependent
models of integrated magnetic components, accounting for the materials and winding layout
of the magnetic component....
