Hybrid Rectifier Excels in Power ORing Applications
Jun 1, 2004
ORing diodes are a necessary evil of high-reliability systems. They're used to isolate redundant power sources so a failure of one source won't bring...
MOSFET Packaging Boosts Current Density
May 1, 2004
The newest silicon technology has made packaging the limiting factor for higher performance MOSFETs. In some of the latest products, as much as 50% of...
Are Trench FETs Too Fragile for Linear Applications?
Jan 1, 2004
A comparison of the forward-biased safe-operating-area
(FB-SOA) performance of one trench and one planar device
of similar die size is presented. The results educate designers
on issues concerning trench and planar MOSFETs in the
linear region of the device operating characteristics....
Paradigm Shift in Planar Power MOSFET Technology
Nov 1, 2003
New planar power JBSFET architecture increases dc-dc converter efficiency because of a dramatic improvement in the RDON *QGD figure-of-merit and the integration of a maximum current rated Schottky diode, within the power MOSFET cells to clamp-off the parasitic body diode....
Scaling New Heights in Power MOSFETs
Oct 1, 2003
Although the development of power MOSFETs began with the V-MOS structure, the first commercially successful devices were based on the DMOS structure....
The Evolution of Smart Power Relays
Jun 1, 2003
Let's compare smart power relays with their traditional electromechanical counterparts to see which one outperforms the other....
Package Characteristics Impact MOSFET Losses
Dec 1, 2002
Although the SO8 package has the advantage of a small footprint, it's thermally inferior to power packages, such as LFPAK. ...
