MOSFET Package Reduces Thermal Resistance

Aug 1, 2007 4:21 PM

Vishay Intertechnology’s seven p-channel power MOSFETs are available in a PowerPAK ChipFET package that offers advanced thermal performance in a 3-mm x 1.8-mm footprint. Specifically, the devices feature 75% lower thermal resistance values, a 33% smaller footprint, and a 23% thinner height profile (0.8 mm). Maximum power dissipation is 3 W. Among the seven are single, dual, and single-with-Schottky-diode power MOSFETs. All devices are pin-compatible with products in the standard ChipFET package.

Single p-channel power MOSFETs in the PowerPAK ChipFET family are rated for typical thermal resistance values as low as 3°C/W (junction-to-case), with maximum on-resistance values as low as 0.021 Ω in a 20-V drain-to-source p-channel single-channel device and 0.064 Ω in a dual-channel device. Complementary co-packaged n- and p-channel PowerPAK ChipFET MOSFETs feature on-resistance values of 0.039 Ω for the n-channel component and 0.072 Ω for the p-channel component. Pricing in 100,000-piece quantities starts at $0.20.