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Discrete Semiconductors
600V GenX3 XPT IGBTs Exhibit Improved Operating CharacteristicsApr 30, 2012 5:19 PM Abdus Sattar GenX3 IGBTs reduce power losses, improve efficiency, reduce system heat sink size, and increase the current density in a board assembly. They suit applications requiring both high efficiency and ruggedness.... Miniature High-Speed Switching Diodes Reduce PCB SizeDiodes Incorporated has introduced a family of high-speed switching diodes in a choice of small footprint, low-profile packages, enabling significant reductions in component count and PCB area.... advertisement
Discrete Semiconductor NewsTexas Instruments Acquires CICLON SemiconductorTexas Instruments Incorporated (TI) acquired Bethlehem, PA-based CICLON Semiconductor Device Corporation, a leading designer of high-frequency, high-efficiency power management semiconductors... China's Semiconductor Market to Fall 5.8 Percent in 2009China's semiconductor industry is expected to contract in 2009, the first time a significant decline has occurred since iSuppli Corp. began gathering statistics on the market-and perhaps for the first time in the history of the nation's chip business... High-Voltage Power MOSFETs Use Advanced Process TechnologyToshiba America Electronic Components, Inc. (TAEC) introduced a new series of high-voltage pi-MOS VII MOSFETs that combine advanced process technology with a planar process to provide a wide selection of voltage and RDS(ON) ratings... TrenchFET(R) Power MOSFET in MICRO FOOT(R) Chipscale PackageVishay Intertechnology, Inc. released the industry's first TrenchFET power MOSFET in the chipscale MICRO FOOT(R) package to feature backside insulation... |
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advertisement advertisement Discrete Semiconductor NewsTexas Instruments Acquires CICLON SemiconductorChina's Semiconductor Market to Fall 5.8 Percent in 2009High-Voltage Power MOSFETs Use Advanced Process Technology |
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