Mobile Internet Devices Give Rise to New Power Management Chips

Jan 9, 2008 5:02 PM
by David Morrison, Editor-in-Chief, Power Electronics Technology

With their demands for high levels of functional integration and long battery life, the next generation of mobile internet devices (MIDs) is inspiring the development of power management ICs tailored to the applications. Companies such as Freescale Semiconductor, NEC Electronics, Dialog Semiconductor, and Texas Instruments are leveraging their expertise in mixed-signal IC design, semiconductor process technology, and manufacturing to create the new chips, which may also contain audio, interface, and other functions.

Chipmakers Collaborate

Earlier this week at the Consumer Electronics Show, Freescale announced it is partnering with Intel Corporation to develop a mixed-signal power management chip set based on Freescale SMARTMOS technology. This chipset will provide a high-performance audio and power management solution for Intel-based MIDs and is being designed to efficiently manage power, enabling smaller form factors and longer battery life.

“This collaboration combines the strengths of two semiconductor industry leaders to address complex power-management challenges for next-generation Mobile Internet Devices," said Arman Naghavi, vice president and general manager of Freescale's Analog, Mixed-Signal & Power Division. "Freescale’s process technology and IP provide an ideal complement to Intel's leadership and technology innovation in mobile processing.”

The audio and power management chip set is to be manufactured using Freescale's SMARTMOS technology, a high-voltage CMOS-based process that enables high integration of precision analog, power devices and logic. When paired with Intel's low-power processors and chipsets, the power management chip set is expected to provide an energy-efficient processing solution for a range of MIDs.

“Mobile Internet Devices are an exciting growth opportunity for the industry and will enable consumers to carry a full Internet experience in their pockets,” said Pankaj Kedia, director of global ecosystem Programs in the Ultra Mobility Group at Intel Corporation.

Initial samples of Freescale's power management ICs are expected to be available in the second half of 2008.

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