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Power Package Enables Increased Power Density

Dec 26, 2006 9:04 AM

Vishay’s miniature package type for its Trench MOS Barrier Schottky (TMBS) and planar Schottky rectifiers enables higher-current-density power supply designs with its compact dimensions and ability to handle up to 100 V and 12 A. With a 1.1-mm height and 4.8-mm by 6.7-mm footprint, the new devices in the SMPC package are designed to provide more power in a smaller space for applications including secondary rectifiers and freewheeling circuitry for ac-dc and dc-dc converters.

The three TMBS rectifiers in the SMPC package released today feature voltage ratings up to 100 V and high current power densities of 8 A to 12 A. The 16 new planar Schottky rectifiers provide voltage ratings from 20 V to 100 V, and high current power densities from 3 A to 10 A. As shown in the table, all the devices feature a very low forward voltage drop, and special wide-bottom plate designs that provide high heat dissipation.

The single- or dual-chip, surface-mount SMPC (TO-277A) package of these new rectifiers features solder pads that are compatible with other SMD devices, so no modification is needed to the PCB layout when they are used as higher-performing upgrades to existing devices. Pricing in 1000-piece quantities is $0.25 per piece for the SS10P4.