SMT Power Inductors: Packing More Performance into Tiny Packages
Jul 1, 2003
Compact, powerful, and easy to work with, SMT magnetics are becoming a mainstay in power supplies of all kinds. This special report uncovers latest developments on this front as developers wring more performance from a miniature package....

Thermal Design and Packaging for Proper Power Management
Jun 1, 2003
Packaging and thermal design are driven by increased power density and the many trade-offs in power topology selection....

Low-Temp Co-Fired Magnetic Tape Yields High Benefits
Jan 1, 2003
Low-temperature co-fired ceramic (LTCC) ferrite combined with screen printable silver conductor and low permeability dielectric produce small, low power, low profile transformers - with no wire or discrete core....

New Packages Enable Smaller Portable Electronics
Dec 1, 2002
A review of surface-mount power semiconductor packages intended for portable electronics....

Package Characteristics Impact MOSFET Losses
Dec 1, 2002
Although the SO8 package has the advantage of a small footprint, it's thermally inferior to power packages, such as LFPAK. ...

Clamping Technique Improves IGBT Installation
Oct 1, 2002
Use of clamps eliminates the drilling and tapping of holes to mount modules with screws....

6.5kV IGBT Module Delivers Reliable Medium-Voltage Performance Part 2: Packaging
Sep 1, 2001
IGBT modules constructed with AlSiC-baseplates and AIN-substrates offer the most reliable module concept available today....

New Power MOSFET Packages Cut DC-DC Converter Size
Jun 1, 2001
Smaller packages exhibit better thermal properties than older versions....

Comparison of Semiconductor Mounting Techniques Reveals Thermal Differences
May 1, 2001
Optimized heat sink, interface materials, and attachment method required for efficient cooling....

EMI Shielding Delivers ''Quiet'' Systems
Feb 1, 2001
EMI shielding gaskets protect against radiation from metal interfaces....

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