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Buck Converter Losses Under the Microscope
Feb 1, 2005
The synchronous buck converter is the most popular topology in the PC market. The race between the top MOSFET companies is heating up with the rush to design new devices that are faster and better suited to meet the demands of the microprocessor makers....

Exploiting Integrated Planar Magnetics
Jan 1, 2005
By combining two or more magnetic elements into a single structure, magnetic integration allows more efficient use of a core's cross-sectional area and reduces the need for core material....

Power Packaging Spins New Automotive Capabilities
Nov 1, 2004
A power packaging technology from International Rectifier (IR) improves current handling capabilities and lowers cost versus existing packaging techniques....

High-Density Power Package for the PC Market
Nov 1, 2004
The very high current demands of modern PCs have placed pressures on dc-dc converter design engineers to come up with solutions that meet ever-increasing...

MOSFET is Thermally Enhanced for DC-DC
Nov 1, 2004
The SO-8 has been the most popular package type used for power MOSFETs in dc-dc converters for more than a decade. The package is well understood and...

MOSFET Packaging Boosts Current Density
May 1, 2004
The newest silicon technology has made packaging the limiting factor for higher performance MOSFETs. In some of the latest products, as much as 50% of...

SMT Power Inductors: Packing More Performance into Tiny Packages
Jul 1, 2003
Compact, powerful, and easy to work with, SMT magnetics are becoming a mainstay in power supplies of all kinds. This special report uncovers latest developments on this front as developers wring more performance from a miniature package....

Thermal Design and Packaging for Proper Power Management
Jun 1, 2003
Packaging and thermal design are driven by increased power density and the many trade-offs in power topology selection....

Low-Temp Co-Fired Magnetic Tape Yields High Benefits
Jan 1, 2003
Low-temperature co-fired ceramic (LTCC) ferrite combined with screen printable silver conductor and low permeability dielectric produce small, low power, low profile transformers - with no wire or discrete core....

New Packages Enable Smaller Portable Electronics
Dec 1, 2002
A review of surface-mount power semiconductor packages intended for portable electronics....

Package Characteristics Impact MOSFET Losses
Dec 1, 2002
Although the SO8 package has the advantage of a small footprint, it's thermally inferior to power packages, such as LFPAK. ...

Clamping Technique Improves IGBT Installation
Oct 1, 2002
Use of clamps eliminates the drilling and tapping of holes to mount modules with screws....

6.5kV IGBT Module Delivers Reliable Medium-Voltage Performance Part 2: Packaging
Sep 1, 2001
IGBT modules constructed with AlSiC-baseplates and AIN-substrates offer the most reliable module concept available today....

New Power MOSFET Packages Cut DC-DC Converter Size
Jun 1, 2001
Smaller packages exhibit better thermal properties than older versions....

Comparison of Semiconductor Mounting Techniques Reveals Thermal Differences
May 1, 2001
Optimized heat sink, interface materials, and attachment method required for efficient cooling....

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