Power Electronics

Packaging

Optimize Power Factor Correction Inductors 
Apr 1, 2011
The world is moving toward greater use of power factor correction (PFC). ...

Isolated Voltage/Current Detection Optocouplers 
Jan 26, 2010
Avago Technologies announced two new miniature voltage/current threshold detection optocouplers for use in a wide range of industrial control applications...

Wire-Actuated Encoders Provide Large Measuring Range In A Compact Design For Space-Constrained Applications 
Jan 26, 2010
Siko Products has introduced a slim, compact design and the measurement length of up to 3000 mm make the SG20 and SG30 Wire-Actuated Encoders ideal for space-constrained applications such as crane manufacturing where it is primarily used for measuring the position of the crane support adjustments...

Vertical Mount Planar Magnetics 
Dec 21, 2009
Vertical mount planar magnetics provides 500Watts of peak output power, in a push-pull converter at 300kHz...

Ultra-Broadband Capacitor Series Minimizes Insertion and Return Loss 
Nov 23, 2009
AVX Corporation has developed a broadband capacitor that addresses DC blocking issues from 16kHz (-3dB roll-off) to 40GHz by providing low insertion and return losses. The broadband capacitor is ideal for applications such as semiconductor data communications, receiver optical subassemblies, trans-impedance amplifiers and test equipment....

Push-button, Side-Entry Terminal Block Features Exclusive Internal Jumper System 
Nov 23, 2009
WAGO Corporation's 805 Series side-entry PCBs simplify wiring via push-in and push-button-actuated terminations...

Thin Embedded Capacitors for Substrates 
Aug 11, 2009
Murata Electronics North America has introduced the GRU series, the world's thinnest embedded monolithic capacitor for placement below ICs and other components on substrates. ...

Steering Diode Array Device Optimized for ESD, EFT and Surge Protection 
Aug 11, 2009
Bourns, Inc. announced the introduction of a new steering diode array that provides up to six lines of protection using the "rail to rail" clamping technique with low leakage current and low capacitance per line. ...

Leadless Power Package Cuts SO-8 Down to Size 
Nov 1, 2008
Now available from multiple sources, a 3.3-mm x 3.3-mm MOSFET package reduces pc-board space requirements by up to 63% versus the SO-8, while offering similar thermal and electrical performance...

Thermal Sensing Requires System-Level Design 
May 1, 2007
Using digital temperature sensors to monitor heat-generating components or ambient environments requires an understanding of package thermal characteristics and conductive heat transfer applied at the pc-board level. ...

Capacitor Values: Don't Believe the Label 
May 1, 2007
Variation in capacitor characteristics due to dc bias and other effects impact power-supply design and simulation, and their impact becomes greater as designers pursue higher performance and higher reliability....

Better Power Packages Make Better Circuits 
May 1, 2007
Advanced power packages are breaking barriers that affect dc, ac and thermal performance in switch-mode power supply circuits for a broad range of applications. ...

ESD Protection Array Integrates Eight Diodes 
Apr 11, 2007
The VESD05A8A-HNH from Vishay Intertechnology is an ESD-protection array that integrate eight diodes in a leadless LLP1713 package...

Motion-Control Platform Takes Flight 
Nov 1, 2006
With the introduction of the IRMCT3UF1 motor-control module, International Rectifier (IR) has taken motor-control technology originally developed for...

Buck Converters Squeeze into Tiny QFNs 
Sep 1, 2006
Using its multi-megahertz switching and co-packaged inductor technology, Enpirion has expanded its lineup of integrated buck converters with tiny footprints...

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