Vendor Provides Through-Hole Packaging for all ICs
May 30, 2007 2:30 PM
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Vicor now provides through-hole packaging option for all V•I Chips, including MIL-COTS. This is in addition to existing surface mount (SMT) compatible packaging, doubling the available range. Through-hole products are electrically and thermally identical to the SMT versions and are compatible with both hand soldering and wave solder techniques, so they are suited for fast prototyping or large production runs. Through-hole assembly facilitates multi-chip cold-plate or heatsink mounting, making system assembly simpler, faster and cheaper.
