The X3117P dramatically reduces the Printed Circuit Board (PCB) area required when compared to discrete solutions and other POL regulators. The 15-mm × 15-mm LGA package integrates 35 power semiconductor and layout-critical passive components to provide industry-leading current and power densities of 50 A/in.² (7.5 A/cm²) and 165 W/in.² (25 W/cm²), respectively. The ultralow profile 1.4-mm height allows mounting on the bottom side of a host PCB, further reducing space consumption on the top side of the board.

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