Edited by PETech Staff

ULTRAmini™ Diodes

They all incorporate multiple, individual, isolated chip devices into a single SOT-363 six lead package. By increasing the device density per package, Central has achieved further board space reduction of up to 67% when compared with two individual SOT-23 dual devices.

For more information, visit www.centralsemi.com.

Want to use this article? Click here for options!
© 2007 Penton Media, Inc.