The innovation represented by the ISL6413 is an enabling factor for size, power and cost reductions of wireless LAN products across the board, including embedded wireless solutions in access points, notebook PCs, PDAs and smart phones as well as plug-in cards of ever-decreasing form factor. Key to the success of this power IC is the small, yet highly thermally efficient, quad flat no-lead (QFN) package. This tiny low-profile 4-mm × 4-mm package is designed to rapidly transfer heat to the PC board and away from the IC. Combined with this thermal efficiency is the high-power efficiency offered by the PWM regulator that results in cool operation and extended battery life in portable applications. This IC reduces current consumption from a 3.3-V supply by as much as 100 mA when compared to an LDO power solution. In addition, a reset function and extensive circuit protection functions are built in.

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