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RF MOSFETs Jul 8, 2003 12:00 PM, Edited by PETech Staff 7/8/2003
Edited by PETech Staff
The Z-MOS TM portfolio is packaged in the low inductance, low profile, electrically isolated, surface-mount DE275 and DE275X2 packages. The matched thermal coefficient of expansion between the aluminum nitride substrate and the Z-MOS TM die results in improved reliability and power cycling performance.
For more information, visit www.ixysrf.com.
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