By Ashok Bindra, Editor, PETech

Interoperability Lab Begins Multivendor PoE Testing

In essence, the interoperability testing was performed on a complete matrix of powered devices (PDs) and power sourcing equipment (PSE). Primarily, the focus was on physical layer testing for these two product groups. On the PSE side, detection, classification, and power application functions of the device under test (DUT) were examined. According to test engineer Jeremy Kent of UNH-IOL, the unit is tested to ensure that it sends out proper detection and optional sequences, and falls within the constraints of the standard with regards to pulse timing, voltage and current levels, and noise levels. In addition, several other power supply output parameters are outlined in the PSE test suite.

On the PD end, the unit was tested to see if it presents a valid detection signature when it is requesting power over the interface and that it provides classification information about its power requirements to the attached PSE. Furthermore, tests were done to see if the PD under test becomes operational after it receives power.

”We put each PSE and PD pair in a real world environment, attached over a 100 m cable. Power is applied to the link segment, and data is exchanged between the two devices to ensure data integrity and operation,” said Kent.

PowerDsine, for instance, tested its Power over LAN Dual In-line Memory Module (PoL-DIMM) technology, which is based on its embedded IEEE 802.3af-compliant Power over LAN ASIC. It also tested its Power over LAN 3000 series of midspans. In addition, TI’s power interface switch TPS2370 and power sourcing equipment manager TPS2383 were tested for interoperability.

PoE Consortium Manager Gerard Nadeau said, “Parametric testing has improved extensively since the last GTP and will continue to advance. Feedback from members participating in the test event will be used to further develop our test procedures and test suites. As a result of this GTP, the number of powered devices in the consortium’s test bed has more than doubled, resulting in a more comprehensive matrix of interoperability testing.”

The UNH-IOL continues to look for new members to expand its interoperability test bed. Another Power over Ethernet GTP will be held later this year.

For more information, visit www.iol.unh.edu/consortiums.

Edited by PETech Staff

Signs Point to Communications Power Recovery

All indications are that the company’s forecast was correct.

Signs of the impending recovery are already appearing. As more users flock to data services, carriers will need to expand and upgrade their networks accordingly. Capital equipment spending is projected to begin as soon as the fourth quarter of 2003 or early 2004. Supply and demand in the equipment industry are achieving a "better balance," as spending rates by service providers approach the historical average of about 15% of their revenue, compared to 30% at the peak in 2000 and steep drop-offs in the following years. More than ever, precise targeting will be critical. In terms of geographic regions, Network Infrastructure will dominate growth in Asia and China while several other regions will see near-term growth dominated by Enterprise Equipment sales. Wireless infrastructure activity will continue to pick up in the Asia Pacific and Europe regions. The fixed-line and cellular penetration rates in China point to a significant communications equipment industry growth opportunity for years to come. In most instances, spending to provide broadband applications for the enterprise will drive Network Equipment sales while spending on computer-telephony integration (CTI) is expected to drive Enterprise Equipment sales. The Semiconductor Industry Association sees strong consumer demand for broadband services such as DSL and cable products.

As the recovery takes hold, the unit market is expected to experience a CAGR of 11.2%, from 156,600 units to 265,600 units over the period from 2003 to 2008. But growth won’t be linear going forward. Due to increasing competition and price cuts, the dollar market may still experience negative growth from 2003 to 2004, even as the unit market grows modestly during the same period. After 2004, growth in dollar sales will slowly start accelerating. In addition to forecasting the dollar and unit market growth for five power system segments (Micro, Small, Medium, Large and CO-Class), this report includes a detailed pricing model for dc power systems.

This in-depth analysis provides detailed dollar, unit and pricing forecasts of the anticipated recovery across regions and equipment segments.

For more information, visit www.darnell.com.

Edited by PETech Staff

17th Annual European Passive Components Conference

The 2003 CARTS-Europe will emphasize “Automotive and Harsh Environments Applications”. An invited paper on the reliability of lead-free solder in low temperature use will be presented. Other papers on capacitors and resistors, performance, construction and raw materials are scheduled for presentation over the three day conference. An additional seminar will highlight Trends and New Technology for passive components. Topics presented at the seminar will include integrated passives, MEMs, the impact of nanotechnology on passives, the use of copper for EME terminations and more.

CARTS is the only conference devoted 100% to the technology of Passive Components.

For more information, visit www.ecii-ltd.com or call 44-1793-434004 in England.

Edited by PETech

Cookson Electronics Equipment Opens Manufacturing Facility in China

“This partnership demonstrates our commitment to the Asian market. Our focus is to establish the manufacture of Speedline’s highly successful midrange printers in China and further consolidate Speedline’s value leadership position,” said Richard Willshere, global outsource manager, Speedline Technologies. “Partnering with MMI is an excellent geographic and strategic decision. Outsourcing will offer our customers greater flexibility and will help meet overall product demand. It’s important for us and our customers to be closer to the market.”

Willshere, responsible for selecting outsource partners, added that the search for a partner in the Asian market place was based on a set of stringent criterion. “We sought a partner that would complement Speedline’s quality service and business philosophy. We considered everything from business ethics and quality to value and financial stability. The new Asian operation will serve the local fast-growing markets but will be flexible enough to meet the global demand for the product.”

MMI will manufacture MPM Accuflex™ and Microflex™ printers to customer configurations. The performance and flexibility these products offer are ideally suited to meet exact customer needs.

For more information, visit www.cooksonee.com.

Edited by PETech Staff

Canadian Government Picks Power Innovations for Homeland Security Protection

To provide the Canadian government's critical systems and operations with power quality and backup solutions, Power Innovations is partnering with the Baxter Group, a leading Canadian distributor of security equipment. Currently, the Baxter Group deals with the foremost Canadian government agencies to provide solutions that are at the forefront of technology.

Like other governments, Canada relies on electronic equipment for homeland security and other essential functions. "With Power Innovations UPQ technology, the threat of power shutting down or damaging our security equipment has been eliminated," said Scott Ray, Canadian Air Transportation Security Authority general manager.

Of necessity, passenger time in airports has already been extended due to proactive airport security measures. Additional delays due to glitches in equipment operation—caused by unreliable power quality or power outages—are no longer experienced. Power Innovations UPQ technologies provide prefect, dependable power to all connected equipment—regardless of the quality of incoming utility or generator power. These systems also provide backup power in the event of power outages.

The Baxter Group intends to integrate Power Innovations small and large-scale UPQ applications, ranging up to 320kVA, into every solution it provides.

For more information, visit www.power-innovations.com.

Edited by PETech Staff

Vishay Names New Executive VP

“Glyndwr Smith has been with Vishay for almost 30 years in many capacities, including marketing, sales, and management of corporate growth through strategic acquisitions,” said Dr. Felix Zandman, Vishay's chairman and CEO. “I have utmost confidence in his abilities to help Vishay continue its growth and innovation.”

In addition to serving in his new position of executive vice president, market intelligence, Smith will remain assistant to the CEO. He is also chairman of the board of Siliconix Inc., an 80.4%-owned subsidiary of Vishay.

Smith represents Vishay in many industry association positions, including EIA treasurer, ECA past chairman, and director of the EDS and ECTC conferences. He also serves as principal Vishay spokesperson to the public and press, providing information on Vishay's products, applications, technology directions, and markets.

For more information, visit www.vishay.com.

Edited by PETech Staff

Dual-input, USB/AC-Adapter, Li+ Chargers

The MAX1551/MAX1555 accept operating input voltages up to 7V and don’t require external FETs or diodes. When USB power is connected without dc power, the charge current is set to 100mA (max). This allows charging from both powered and unpowered USB hubs, with no port communication required. When both dc and USB power are connected, charging current is set at 340mA (typ). No input-blocking diodes are required to prevent battery drain.

The MAX1551 includes a power-OK (POK-bar) output to indicate when input power is present, and the MAX1555 includes a charge (CHG-bar) output to indicate charging status. On-chip thermal regulation simplifies PC-board layout by regulating charge current based on charger die temperature. This maximizes charge rate and minimizes component-size guardbanding. When the MAX1551/MAX1555 thermal limit is reached, the charger reduces charging current instead of shutting down.

The MAX1551/MAX1555 are available in a tiny 5-pin SOT23 package and are screened for the extended industrial temperature range (-40°C to 85°C). An evaluation kit is available to speed designs.

For more information, visit www.maxim-ic.com.

Edited by PETech Staff

Common Mode Choke Coil

For more information, visit www.murata-northamerica.com.

Edited by PETech Staff

Low Pin Count Li-Ion Battery Charger IC

The IC's synchronous dc-dc step-down operation allows up to 96% operating efficiency from supplies from 6V to 28V supplies.

Also, the LTC4006 operates at up to 98% duty factor, which permits 0.5V dropout operation and allows charging from low voltage wall adapters. To improve safety during charging, the LTC4006 features a battery temperature monitor as well as overvoltage and overcurrent protection. End applications include memory backup systems, portable medical and automotive diagnostics, GPS, as well as notepad and notebook PCs.

The LTC4006 features a quasi-constant frequency, constant off-time architecture that doesn’t generate audible noise even when using ceramic capacitors. The IC is offered in three versions for 8.4V (2-cell), 12.6V (3-cell), and 16.8V (4-cell) float voltages with ±0.8% accuracy. Charging current is programmable with a resistor to ±4% typical accuracy. For gas gauging, a proprietary feature represents the charging current as a voltage to a microcontroller or an A/D converter. A resistor sets total charge time from 1 hr to 3 hr. The LTC4006 includes automatic recharge and trickle charging. It operates from -40°C to 85°C.

For more information, visit www.linear.com.

Edited by PE Tech Staff

150W Switcher

The PAS150 switcher not only meets all Class A PFC requirements, but also provides greater reliability and higher MTBF (mean time between failure) through use of fewer components. Furthermore, the relative cost per Watt of a passive PFC switcher like the PAS150 is significantly less than a comparable switch mode power supply employing active PFC techniques.

In operation, the PAS150 switcher provides a universal 115/230Vac input selection and a single output of 150W continuous power. The user can select one of several factory-set output voltages, including 3.3V, 5V, 12V, 24V, and 48V. The PAS150 switcher features optional current-sharing capability for 1+1 redundancy with no special interconnection requirement. Other options include remote on/off, and droop or single-wire current sharing with OR-ing diodes. The standard unit provides superb heat dissipation, and also offers an optional fan with its own 12Vdc supply.

For more information, visit www.t-yuden.com.

Edited by PETech Staff

Worlds Highest Energy Standard Batteries

The new 95Wh Li-ion standard batteries were launched in response to customer demand for longer running battery packs and batteries providing higher discharge currents. Both batteries use the industry-standard SMBus smart battery system and employ the regular 5-pin standard battery connector. They share identical cases, weigh 647 g (1.43 lb), and are capable of a 6A continuous drain from 0°C to 50°C.

Both batteries can be shipped as normal, nonhazardous goods under the DOT Li battery transportation regulations. A belt-mounted battery pack system is currently in design for high-energy applications that use belt-mounted power sources.

In addition to these new batteries, Inspired Energy has increased the capacity of its existing standard Li-ion batteries from 6Ah to 6.6Ah, and introduced a range of battery diagnostic tools.

For more information, visit www.inspired-energy.com.

Edited by PETech Staff

Power Hermetic MOSFETs

For more information, visit www.advancedpower.com.

Edited by PETech Staff

Lead-free PolySwitch Devices

They meet the same specifications as their standard counterparts, and are capable of withstanding the higher melting temperatures associated with lead solder alternatives. They can also be installed using current reflow profiles, facilitating migration to lead-free manufacturing and assembly. Component solderability meets standard industry specifications, including J-STD-002.

The lead-free SMD devices are available in tape and reel packages and shipped in moisture barrier bags.

For more information, visit www.tycoelectronics.com.

Introducing Keynote Speakers for This Year's Conference

Mr. Trey Burns, Vice President, Worldwide Technologies—Artesyn Technologies “Are You Ready for the Future.” Will power electronics engineers have the tools, the skills and the technologies needed to continue to deliver attractive solutions? In this keynote address, we will explore this question and offer one view of the challenges facing power electronics engineers in the near future.

Mr. Alex Lidow, CEO—International Rectifier “Systems Approach to Solving Challenges in DC/DC Technology.” This presentation will address specific needs for power management systems, new control methods for PFC, a path to further integration for both DC/DC and AC/DC and scalable architecture that yields shorter design cycles, lowers costs and improves densities.

U.S. Exhibitors Gear Up for Productronica 2003

"U.S. companies will have a unique opportunity to showcase their products and services to 45,000 international visitors expected at this year's show," said Noel Hoekstra, President and Chief Operating Officer at Munich Trade Fairs North America, the U.S. subsidiary of Messe München. "No other show brings this many worldwide leaders in electronics production together under one roof."

Productronica integrates the entire electronics production chain from development to services through state-of-the-art exhibits. The exhibit floor plan is organized by product category, helping visitors easily find the companies and products they are looking for.

Tradeshow visitors are representatives from industrial, automotive and communications electronics, consumer electronics, precision mechanics and optics, medical, measurement and control technology, mechanical engineering, aviation and aerospace, chemical industry and rubber and plastic goods.

For more information about visiting Productronica, go to www.munichtradefairs.com/Productronica/Visitor. To check out the list of exhibitors, search the exhibitor database: Productronica Exhibitor List. Those wishing to exhibit at Productronica can contact Randi M. West at 312-377-2650.

By Ashok Bindra, Editor, PETech

Discrete Power Semiconductor Supplier Eyes SiC Diodes

Using alternative packaging and innovative engineering, APT intends to address market segments not served by Cree. In addition, it will explore military, industrial, communications, semiconductor equipment, and medical applications for its SiC Schottky diodes and other designs created using these high-performance diodes. According to Glenn Wright, APT’s vice president of marketing and business development, APT intends to explore applications where low losses are critical and cost is warranted. This marks APT’s first offerings in SiC, said Wright.

In addition to standard plastic packages, the SiC diodes will be available in hermetic and high-performance packages. The plastic packages will be assembled in the Philippines, while the hermetic and advanced packages will be produced in the company’s facilities in Bend, Ore., and Bordeaux, France. APT will use its expertise in high-power semiconductor manufacturing to offer multidie parallel discrete devices in TO-220, TO-247, D2, D3, and SOT-227 packages, as well as hermetic packages with and without military screening. The dual-die packages will offer common cathode configuration. Furthermore, the supplier will offer the latest generations of MOSFETs and IGBTs built in combination with the SiC Schottky diodes in both boost and buck configurations. Power modules and other custom designs using the SiC zero recovery Schottky diodes will also be offered.

All SiC-based diodes in plastic packages will be rated at 175°C, while hermetic and high-performance packages will be rated at higher temperatures. Due to higher band gap property, these devices will offer extremely low leakage at elevated temperature. Other features include high thermal conductivity, faster switching speed compared to silicon diodes, and 600V to 1200V breakdown capability.

APT is already in sampling mode of 6A and 10A SiC Schottky diodes in plastic packages with plans to take these into production in the fourth quarter.

For more information, visit www.advancedpower.com.

Edited by PETech Staff

ULTRAmini™ Diodes

They all incorporate multiple, individual, isolated chip devices into a single SOT-363 six lead package. By increasing the device density per package, Central has achieved further board space reduction of up to 67% when compared with two individual SOT-23 dual devices.

For more information, visit www.centralsemi.com.

Edited by PETech Staff

Fairchild to Convert All Products to Lead-Free Finish Packages

Fairchild’s lead-free packages meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020B, are compliant with the European Union requirements that will take effect in 2005, and meet additional conditions delineated by key customers.

Fairchild launched its Pb-free initiative to provide its customers with lead-free package finishes, responding to concerns about the environmental impact of lead, historically used in solder finishes and lead coating in electronic components.

JEDEC requires moisture sensitivity level (MSL) certification using reflow peak temperature testing to 250°C. This higher temperature testing is required to ensure that packages attach properly to printed circuit boards. A majority of Fairchild’s surface-mount lead-free packages have been tested to a peak reflow temperature of 260°C to provide customers with additional reliability assurance.

The primary lead-free finish used by Fairchild is pure matte tin, providing stable plating highly compatible with widely used tin-lead solder processes. It’s also compatible with Pb-free board assembly processes, such as those using tin-silver-copper (SnAgCu) solders.

For more information, visit www.fairchildsemi.com.

Edited by PETech Staff

ABB Motors/Drives Used to Attempt Electric Land Speed Record

Powered by the dc batteries and controlled by the ACS800 ac drives that feature the company's exclusive Direct Torque Control (DTC) motor control algorithm, the two motors already have propelled the e=motion car to 146 mph during testing. This unofficially broke the 139 mph U.K.-record for the fastest speed traveled by an electric vehicle. The car will be moved to Tunisia in September and the vehicle's designers, Mark Newby and Colin Fallows, will attempt to set the new world electric land speed record. A U.S. team holds the current world record of 247 mph.

For more information, visit www.abb.com.

Edited by PETech Staff

Battery Charger

The MAX1874 accepts input voltages up to 6.5V (max) and doesn’t require diodes or an external MOSFET. DC-input overvoltage protection up to 18V (max) can be added with a single SOT PFET. It also features battery-to-dc power switchover to drive the system directly from the power source instead of the battery.

Thermal regulation of the charger temperature simplifies PC-board layout, minimizes component size guardbands, and maximizes the charging rate under all battery and input voltage conditions. Instead of shutting down when the thermal limit is reached, the MAX1874 simply reduces the charging current. In addition, ambient or battery temperature can be monitored with an external thermistor as a separate safety feature.

The MAX1874 is available in a 5 mm × 5 mm, 16-pin TQFN package and is specified for the extended-industrial temperature range (-40°C to 85°C). An evaluation kit is available to speed designs.

For more information, visit www.maxim-ic.com.

Edited by PETech Staff

Altair Engineering and Ansoft Corp. Form Partnership

The integration of HarnessLink and SIMPLORER provides automotive, aerospace and marine manufacturers a complete design environment for electrical distribution systems. HarnessLink's sophisticated data-management capabilities and SIMPLORER's fast and efficient system analysis engine allow design engineers to analyze a wide range of vehicle configurations with a high degree of automation. The combined solution allows engineers to size and validate a vehicle electric system and to identify design tradeoffs by performing what-if studies in rapid succession.

"The shorter time required for simulation means that issues can be detected earlier," said Tony Norton, director, electrical and mechatronics for Altair Engineering. "The acceleration of the process even allows simulation to be used as a design tool and not just for verification."

For more information, visit www.altair.com or www.ansoft.com.

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