Power Electronics


AMI Semiconductor Joins FlexRay Consortium

Jan 20, 2004 12:00 PM, Edited by PETech Staff

AMI Semiconductor recently announced its associate membership to the FlexRay Consortium—a move that will further strengthen the company’s support for in-vehicle networking (IVN) applications.

By becoming a member of the Consortium, AMIS has access to the FlexRay technology, with a free-of-charge, royalty-free licence for automotive applications. In addition, the company will have access to early industry information and the results of FlexRay developments, along with the FlexRay-related IP of all other FlexRay members.

“Becoming an associate member of the FlexRay Consortium supports our objectives to continually strengthen our portfolio of IVN products and will enable us to design custom SoC solutions that are optimised to the requirements of the growing X-by-wire and safety critical applications market,” said Hervé Branquart, AMI Semiconductor’s worldwide marketing manager of integrated mixed-signal products for the automotive market.

Formed in September 2000, the FlexRay Consortium is responsible for driving the adoption of an open standard for high-speed bus systems for X-by-wire and other distributed control vehicle applications. As a manufacturer of IVN ASSPs and advanced, system on chip (SoC) solutions based on mixed-signal technologies for the automotive sector, the applications that the FlexRay standard is enabling are key strategic targets for AMIS.

For more information, visit www.amis.com or www.flexray.com.




April 1, 2012
power electronics technology magazine current issue cover




 
Back to Top

Topic Index

Discrete Semis
Bipolar Transistors
IGBTs
Power Modules
Power MOSFETs
Rectifiers/Diodes
Thyristors

Power Management
Digital Power Control
High-Voltage Devices
LED Drivers
Lighting Power Management
Motor Power Management
Power ICs
PWM Controllers
Regulator ICs

Portable Power Management
Batteries
Battery Charger ICs
Fuel Gauges Controllers and Regulators
Micro Fuel Cells

Passives/Packaging
Capacitors
Circuit Protection Devices
Connectors
Magnetics
Packaging
Printed Circuit Boards
Resistors
Sensors & Transducers
Switches & Electromagnetic Relays

Topic Pages
Wind Power
Flyback Transformers

Thermal Management
Fans
Heatpipes & Spreaders
Heatsinks
Liquid Cooling
Thermal Interface Materials
Thermal Management Simulation

Power Systems
DC-DC Converters
Distributed Power Architectures
EMI & EMC
Linear Power Supplies
Safety/Environmental Approvals
Simulation/Modeling
Switch-Mode Power Supplies
Test & Measurement Uninterruptible Power Supplies

Digital Power
Commentaries
Digital Power News
Digital Power Products
Design Features


Contact Us  E-mail Webmaster  For Advertisers  For Search Partners  Privacy Statement  Subscribe  Terms of Use
© 2011 Penton Media, Inc. All rights reserved.