Power Electronics



IC Maker Closes Assembly Plant in Singapore

Jul 20, 2005 1:45 PM


National Semiconductor has announced plans to close its assembly and test plant in Toa Payoh, Singapore. The closure is consistent with National’s ongoing program to maximize resources and support for its analog businesses.

Following National's March 10, 2005, announcement to seek a buyer for its Singapore plant, the company has now decided to accelerate its cost savings by closing the plant and consolidating its production volume into National's two other assembly and test plants in Melaka, Malaysia, and Suzhou, China.

A majority of the equipment that is currently in Singapore will be transferred to the other assembly and test plants and used to support ongoing products and customers. However, the closure will affect about 950 employees, including professional staff, technicians and operators. The management team in Singapore will work with local government agencies and other employers on job placement opportunities for affected employees.

In connection with the shutdown, the company currently estimates that it will incur charges in the range of $27 million to $30 million during the first quarter of fiscal 2006, primarily for severances. The majority of the activities associated with the closure, including equipment transfers to other plants, are expected to take place over nine to 12 months. The company expects to eventually achieve quarterly cost savings of $4 million to $6 million from this action


Acceptable Use Policy blog comments powered by Disqus




April 1, 2012
power electronics technology magazine current issue cover




 
Back to Top

Topic Index

Discrete Semis
Bipolar Transistors
IGBTs
Power Modules
Power MOSFETs
Rectifiers/Diodes
Thyristors

Power Management
Digital Power Control
High-Voltage Devices
LED Drivers
Lighting Power Management
Motor Power Management
Power ICs
PWM Controllers
Regulator ICs

Portable Power Management
Batteries
Battery Charger ICs
Fuel Gauges Controllers and Regulators
Micro Fuel Cells

Passives/Packaging
Capacitors
Circuit Protection Devices
Connectors
Magnetics
Packaging
Printed Circuit Boards
Resistors
Sensors & Transducers
Switches & Electromagnetic Relays

Topic Pages
Wind Power
Flyback Transformers

Thermal Management
Fans
Heatpipes & Spreaders
Heatsinks
Liquid Cooling
Thermal Interface Materials
Thermal Management Simulation

Power Systems
DC-DC Converters
Distributed Power Architectures
EMI & EMC
Linear Power Supplies
Safety/Environmental Approvals
Simulation/Modeling
Switch-Mode Power Supplies
Test & Measurement Uninterruptible Power Supplies

Digital Power
Commentaries
Digital Power News
Digital Power Products
Design Features


Contact Us  E-mail Webmaster  For Advertisers  For Search Partners  Privacy Statement  Subscribe  Terms of Use
© 2011 Penton Media, Inc. All rights reserved.