Thermacore Celebrates its Fourth Decade
Apr 1, 2010 12:00 PM
News & Features From Auto Electronics
Committed to improving hybrid electric cars
New Motors for Hybrid Vehicles
Battery Firms Battle for Hybrid Hegemony
Innovative Bipolar Plates for Fuel Cells
See More Headlines
Top Articles
Exploring Current Transformer Applications
Ultracapacitor Technology Powers Electronic Circuits
Buck-Converter Design Demystified
Sensorless Motor Control Simplifies Washer Drives
PET Resources
Buyer's Guide
Conferences
Engineering Jobs
Power Electronics Events
Rent Our Lists
Spotlight on Digital Power
Thermacore, Inc. announced that it has reached a historic milestone with the company's celebration of 40 years in business. Thermacore, Inc. was formed in 1970 for the purpose of transforming heat pipe technology from a laboratory curiosity into a marketable product to enhance standard heat sinks by dramatically improving thermal performance. Since its founding in 1970, Thermacore has produced tens of millions of heat pipes and other thermal management products to provide efficient cooling for military and aerospace electronics, medical equipment, power electronics, computer microprocessors, communications, and other electronic equipment.
In the late 1980's and early 1990's, Thermacore led the charge in commercializing heat pipe technology for cooling computer microprocessors. The turning point came when Thermacore's sintered powder wick technology became the accepted thermal management solution for a new generation of faster, more powerful processors in the mid-1990s, opening up a wealth of applications and making this technology a de facto standard. Because of that development, virtually every heat pipe with a sintered powder metal wick manufactured in the world today can trace its heritage back to early research and product development performed by Thermacore. They continue to hold that leadership position, moving advanced technology to commercialization with the application of vapor chamber heat pipes to commercial and military platforms, the implementation of pumped liquid cooling for computers, and the integration of advanced materials to compliment heat pipe heat sinks, taking these technologies to the next level of integration.
Acceptable Use Policy blog comments powered by Disqus


