According to the company, extreme temperature range applications demand direct code execution from Flash memory rather than from DRAM. ST’s chip is based on 0.13-micron technology and a design that reduces access times to as low as 45 ns over the automotive temperature range (-408 C to +1258 C packaged, -408 C to +1508 C bare die), enabling it to be used for code execution as well as for storage.

The M58BW032, with a 32-bit databus, is footprint and software-compatible with ST’s earlier M58BW016. The W032 matches the new generation of 75 MHz 32-bit microcontrollers, which are supported by a burst-reading protocol enabled by high-speed logic as well as by 0.13-micron technology.

Features include a 3.3 V core supply, an I/O interface that operates from 1.6 V to 3.6 V, and separate 1.6 V power supplies for I/O buffers. The single bank memory is organized as eight parameter blocks of 64 kbits, three blocks of 128 kbits, an OTP block of 128 kbits, and 62 main blocks of 512 kbits each. It operates in x4, x8 double, long word, or continuous burst modes, with configuration controlled through a dedicated register; access times of 45 ns, 55 ns and 60 ns are available. Maximum burst frequency is 75 MHz over the full automotive temperature range. Flexible protection techniques include WP# pin, 64-bit password tuning protection and a protection register.

The M58BW032 is supplied in LBGA80 and PQFP80 packages, and in certified bare die form. All devices are manufactured in ST facilities qualified to ISO/TS 16949:2002, and for security each die embeds a unique device ID to allow the use of cryptographic algorithms for protection against illegal software modifications.