Power Electronics



ON Semi adds LIN, CAN transceivers; EMI/ESD devices

Oct 20, 2004 5:39 PM


ON Semiconductor has introduced a CAN transceiver, three LIN transceivers, and ESD/EMI protector chips for both buses.

The NCV7356 single-wire CAN transceiver meets the GMW 3089 2.3 specification and provides under-voltage lockout, timeout for faulty blocked input signals, output blanking time in case of bus ringing, and a low sleep mode current, according to Sri Jandhyala, director of automotive market development.

It comes in an 14-lead SOIC fused package. An 8-lead SOIC fused package is in development.

The NCV7380 is a LIN physical layer device for ECU applications with hard standby current requirements where no sleep/wake up control from the microprocessor is necessary, or for single-wire data link applications that don’t require high-speed data rates. Designed according to the physical layer definition of the LIN Protocol Specification (Rev. 1.3 and 2.0) the part comes in an 8-lead SOIC and is said to offer low current consumption. The NCV7382, otherwise identical, includes a wake-up function to detect incoming dominant bus messages and to enable the module voltage regulator.

The NCV7361A is a 5V/50mA voltage regulator with an integrated LIN transceiver. Designers can use it to develop simple, yet powerful LIN bus slave nodes that offer wake-up via the LIN bus.

ON Semi’s NUP2105L and NUP1105L are 27V dual, bidirectional transient voltage suppressors (TVS) designed to protect CAN and LIN transceivers, respectively, from EMI and ESD. Mamoon Rashid, director of marketing for Small Signal Products, said the parts are among the only such devices to offer an integrated solution for dual wire data line protection based on an avalanche TVS technology. The bidirectional configuration prevents inadvertent clamping of normal data line signals due to common mode voltage offset in systems with long cable lengths. Both devices come in SOT-23 packages.


Acceptable Use Policy blog comments powered by Disqus




April 1, 2012
power electronics technology magazine current issue cover




 
Back to Top

Topic Index

Discrete Semis
Bipolar Transistors
IGBTs
Power Modules
Power MOSFETs
Rectifiers/Diodes
Thyristors

Power Management
Digital Power Control
High-Voltage Devices
LED Drivers
Lighting Power Management
Motor Power Management
Power ICs
PWM Controllers
Regulator ICs

Portable Power Management
Batteries
Battery Charger ICs
Fuel Gauges Controllers and Regulators
Micro Fuel Cells

Passives/Packaging
Capacitors
Circuit Protection Devices
Connectors
Magnetics
Packaging
Printed Circuit Boards
Resistors
Sensors & Transducers
Switches & Electromagnetic Relays

Topic Pages
Wind Power
Flyback Transformers

Thermal Management
Fans
Heatpipes & Spreaders
Heatsinks
Liquid Cooling
Thermal Interface Materials
Thermal Management Simulation

Power Systems
DC-DC Converters
Distributed Power Architectures
EMI & EMC
Linear Power Supplies
Safety/Environmental Approvals
Simulation/Modeling
Switch-Mode Power Supplies
Test & Measurement Uninterruptible Power Supplies

Digital Power
Commentaries
Digital Power News
Digital Power Products
Design Features


Contact Us  E-mail Webmaster  For Advertisers  For Search Partners  Privacy Statement  Subscribe  Terms of Use
© 2011 Penton Media, Inc. All rights reserved.