January 2007
By Judy Miller
Associate Publisher

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Dear Electronics Marketer,
"People Don't Want A Quarter Inch Drill, They Want a Quarter Inch Hole"
Professor Emeritus Theodore Levitt famously told this to his students at Harvard Business School. More than any other breed, engineers read business publications for solutions. As we look ahead to the New Year, it's a great time to take a fresh look at your messaging. Are your ads "over filled" with technical specifications and other features or do they offer solid solutions. As marketers, the better understanding you have of the challenges your customer's face, and how your product or service can solve that---the more effective your campaign will be. Power Electronics Technology kicks off the New Year with five feature articles that focus on solutions:
- Power Semiconductors: introduces a new spice model for power MOSFETs that utilizes the Bsim3 model developed by researchers at University of California
- Power Management and Thermal management: discusses an interleaved multiphase buck approach that provides efficiency, size and cost advantage
- Battery/Portable Power Management: addresses issues relating to power conversion and power management in battery and other portable power applications
- Magnetics: examines Gate Drive Transformer Design
- Linear Superposition: examines how this powerful mathematical technique may be applied to many domains and how it is used in predicting device junction temperatures in a complete system, when multiple heat sources are present and steady conditions prevail
In addition to five feature articles, our Web site www.powerelectonics.com and weekly e-newsletter are a great place to reach an audience of loyal readers at the moment they are thinking about how to do their job better. Align your message with these articles, and you will see a quick lift in association with your product and the solutions your customers and potential customers are seeking.
Thank you for your support in 2006. Wishing you all a happy and healthy holiday season!
Best Regards,

Judy Miller
Associate Publisher
212-204-4246
Power Electronics Technology January Issue
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Cover Story: Power Semiconductors:
Power MOSFET Spice Model Utilizing Bsim3
In this article, the authors introduce a new spice model for power MOSFETs that utilizes the Bsim3 model developed by researchers at University of California, Berkeley. This new model with the Bsim3 at its core is able to produce results that are accurate while being easy to use. Simulation times are reduced and convergence issues are minimal or non-existent. It is also capable and useful over the full operating range of the device being modeled.
Power Management:
Shrink Size and Cost with a Stackable Synchronous Buck
The trend for power supplies in the computing industry is towards lower voltages and higher currents. As the load currents increase into the 30A to 150A range, a single power stage is not practical. The power dissipation and stresses on the components are too high for a single stage. There are two approaches for achieving these high currents. The first approach uses multiple power stages without phase shift synchronization. The second approach uses multiple power stages with phase synchronization. In this article, the authors discusses an interleaved multiphase buck approach that provides an efficiency, size and cost advantage.
Battery/Portable Power Management:
This feature will address issues relating to power conversion and power management in battery and other portable power applications. Author to be determined.
Magnetics:
Gate Drive Transformer Design
Gate drive transformers—sometimes referred to as generic pulse transformers—are needed in SMPS circuits to provide electrical pulses for turning on and off high-voltage power MOSFETs. In this article, the authors describe the calculations required in designing gate-drive transformers.
EMC/Power Protection and Thermal Management:
Linear Superposition in Thermal Modeling – Part I
Linear superposition is a powerful mathematical technique that may be applied in many domains. In this two-part article series, the author discusses the use of linear superposition in thermal modeling of electronic packages and systems. In the first part, the author examines how linear superposition may be applied in the “spatial” sense, that is, its use in predicting device junction temperatures in a complete system, when multiple heat sources are present and steady conditions prevail.
History of Power Electronics DVD
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Imagine having 30 years of Power Electronics Technology magazine at your fingertips! Now you can in one DVD with the History of Power Electronics!
Presenting the first-ever, historical look back at the last thirty years in the power electronics industry. This ground breaking DVD is a searchable database of articles and issue covers dating back to the launch of our magazine in 1975, then called Solid-State Power Conversion. Designed as a research tool for electronics engineers, the DVD offers you the evolution of the industry at your fingertips!
To order online, click here and fill out the online order form, or click here for a pdf.
Sponsored by
National Semiconductor
Power Electronics Technology Online
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Using the power of our print content, we’ve redesigned PowerElectronics.com to offer electronics professionals a quick and easy-to-use resource for the latest information on the topics they need to know about. Our new Web site features a database of searchable articles on Discrete Semis, Power Management, Motor Power Management, Passives/Packaging, Thermal Management and Power Systems.
Traffic Stat:
page views: 56,687
unique visitors: 32,784
stickiness: 1.66 pages viewed per session
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As an advertiser, PowerElectronics.com offers you new sponsorship opportunities to increase your company’s exposure, build brand awareness, and drive traffic to your company’s Web site. The new platform offers users and advertisers a superior site experience – greater search capabilities, detailed reporting of site usage and more flexible branding opportunities. Click here for more online marketing opportunities.
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